Manufacturing process, assembly, and system yield optimization for microelectromechanical systems devices

Principal investigator: Rosalind Wynne

University: Villanova University

Industry partners: Electro Soft

Global market outlooks for the MEMS market are predicted to grow from $48.74 Billion in 2018 to $122.83 billion by 2026. Microelectromechanical systems (MEMS) are micrometer-scale devices that integrate optical, electrical, and mechanical elements. This technology impacts smart consumer electronics that include, for example, wearable devices like Apple watches and popular IoT Amazon Alexa towers, as well as collision avoidance sensors for the automotive sector. However, lack of standardized fabrication processes for MEMS and standardized packaging of MEMS directly on to printed circuit board assemblies (PCBAs) in these devices leads to reduced product performance and life spans. This project will take advantage of the existing partnership Dr. Wynne (PI) has already established to focus on optimizing MEMS fabrication, assembly and packaging; printed circuit board assemblies (PCBAs) integration; and multi-channel communications system assembly at the Philadelphia facility. A graduate manufacturing fellow will assess performance detractors in a volume manufacturing environment via a digitally disruptive statistical analysis of test measurements and photonics models to identify key process factors that affect product variability in the automotive sector.