Principal investigator: Bo Li
Co-PI: Qianhong Wu
University: Villanova University
Industry partner: Additive Innovations, LLC
Reaction-bonded silicon carbide is a coveted material for materially intensive applications due to its unique combination of lightweight, high stiffness, and excellent thermal conductivity. This research aims to pioneer a new method to manufacture RB-SiC thin-walled heat exchanger for a local manufacturer, Additive Innovations, LLC, that eliminates the de-powdering challenge in their current binder jet method while maintaining the critical properties of the printed components. Our new method will combine high particle loading direct ink writing, a waste-free 3D printing method developed by Villanova University, and high-temperature liquid infiltration, an advanced densification method specialized by Additive Innovations to increase the density of 3D printed green parts for a thin-wall heat exchanger. This project highlights an in-depth collaboration between industry and academia to examine the scientific feasibility of integrating DIW with HTLI, lay the theoretical foundation, and generate preliminary data for future technology development.