Principal investigator: Tawanda James Zimudzi
University: Pennsylvania State University
Industry partners: Avery Dennison
This project will investigate the critical structure–property relationships governing Anisotropic Conductive Paste (ACP) adhesives used in high‑volume RFID strap‑attach manufacturing. ACPs play a dual role in mechanically securing integrated circuit (IC) chips while providing reliable Z‑axis electrical conductivity through dispersed conductive fillers. Manufacturing yield and long‑term reliability are highly sensitive to ACP formulation and processing parameters, including filler characteristics, curing temperature, pressure, and droplet geometry. This collaboration between Pennsylvania State University (PSU) and Avery Dennison will apply advanced mechanical and microstructural characterization techniques atomic force microscopy (AFM), nano‑indentation, and SEM/EDS to establish correlations between ACP formulation, processing conditions, and final performance. The results will guide process optimization for faster, more robust assembly while training undergraduate students in industry‑relevant advanced manufacturing and materials characterization techniques. This work will directly support innovation, workforce development, and manufacturing competitiveness within Pennsylvania.