Principal investigator: Rahul Panat
University: Carnegie Mellon University
Industry partner: Coherent Corporation
The objective of this collaborative research between CMU and Coherent Corporation, a company headquartered in Pennsylvania, is to develop rapid and cost-effective manufacturing techniques for metal-diamond composites for use as heat-sinks for microprocessor chips. Building on an existing partnership between the two, this project aims to employ low-cost electrodeposition and aerosol jet printing to produce composites with thermal conductivities 25–100% higher than copper (>400 W/m-K). The success of this research will position Pennsylvania as a leader in advanced manufacturing, addressing the critical need for effective thermal management in the emerging area of AI-chips (Thermal Design Power >1kW). It will leverage the combined expertise of Pennsylvania’s higher education institutions and industry leaders in thermal management materials, with the goal of developing advanced solutions for heat dissipation in AI chips. In addition to technical innovations, the project will train the next generation of skilled professionals and enhance the Commonwealth’s economic competitiveness.